近年来发表的学术著作及论文

[1] Xiao Liu, Yongxin Qian*, Xuefei Xu*, Guizhen Wang*, et al. Regulating Local Coordination Environment of Single-Atom Co Absorbers for Dielectric-Magnetic Dual Loss Modulation. Advanced Materials, 2026, DOI: 10.1002/adma.72966.

[2] Long Zhao, Yongxin Qian*, Guizhen Wang*, et al. Ultralight core–shell polypyrrole@bacterial cellulose aerogel for broadband electromagnetic wave absorption and efficient heat insulation. Carbohydrate Polymers, 2026: 125200.

[3] Long Zhao, Yongxin Qian*, Guizhen Wang*, et al. Thermal-Insulating Carbon Foam for Efficient Electromagnetic Energy Absorption and Conversion. Nano Energy, 2025, 111313.

[4] Xiao Liu, Yongxin Qian*, Guizhen Wang*, et al. 3D Carbon Foam/Epoxy Composites for Frequency-Tunable Electromagnetic Wave Absorption and Enhanced Thermal Management. Chemical Engineering Journal, 2025, 165916.

[5] Shuangfu Gang, Yongxin Qian*, Yubo Luo*, Junyou Yang*，et al. 2D-high entropy alloys embedded in 3D-carbon foam towards light-weight electromagnetic wave absorption and hydrophobic thermal insulation. Nano Energy, 2025, 135: 110642.

[6] Hao He, Yongxin Qian*, Xin Li*, Junyou Yang*，et al. Layered double hydroxide embedded in loofah-derived biocarbon composites towards broadband electromagnetic wave absorption and enhanced flame retardancy. Carbon, 2025, 243: 120526.

[7] Haoran Geng, Yanfang Zhao*, Yongxin Qian*, Guizhen Wang*, et al. Enhanced electromagnetic wave absorption and thermal conductivity in epoxy composites with a heterostructure-rich 3D MoS₂/CMF network framework. Composites Science and Technology, 2025, 261: 110993.

[8] Yongxin Qian, Qinghui Jiang, Yubo Luo*, Junyou Yang*, et al. Advanced multifunctional IGBT packing materials with enhanced thermal conductivity and electromagnetic wave absorption properties. Journal of Colloid and Interface Science, 2024, 653: 617-626.

[9] Yongxin Qian, Yubo Luo*, junyou Yang*, et al. Enhanced electromagnetic wave absorption, thermal conductivity and flame retardancy of BCN@ LDH/EP for advanced electronic packing materials[J]. Chemical Engineering Journal, 2023, 467: 143433.

[10] Yongxin Qian, Yubo Luo*, junyou Yang*, et al. Multifunctional epoxy‐based electronic packaging material MDCF@LDH/EP for electromagnetic wave absorption, thermal management, and flame retardancy. Small, 2022, 18(46): 2204303.

国家发明专利

[1] 杨君友；罗裕波；钱勇鑫；许天；徐超超；危颖超；一种多功能高分子基电子封装材料及其制备方法，2024-02-02，中国，CN202210883222.7。

[2] 杨君友；罗裕波；钱勇鑫；陶阳；严伟；李优；郝吉年；兼备导热与电磁波吸收的双功能轻质电子封装材料的制备，2022-05-20，中国，CN202110819446.7。